Отрывок: Energy distribution of secondary electrons is somehow described in [17, 18]. The mean energy of “fast” secondary electrons (energy higher than 100 eV) is about 400 eV for primary electron energy of 20 keV [19]. It seems that the number of sec- ondary electrons with energy higher than 1 keV is negli- gible. So, in the worst case the generation of secondary electrons can results in 30-40 nm broadening of trench. a) b) Fig. 5. T...
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dc.contributor.authorRogozhin, A.-
dc.contributor.authorBruk, M.-
dc.contributor.authorZhikharev, E.-
dc.contributor.authorSidorov, F.-
dc.date.accessioned2017-10-25 12:26:47-
dc.date.available2017-10-25 12:26:47-
dc.date.issued2017-08-
dc.identifierDspace\SGAU\20171020\65776ru
dc.identifier.citationRogozhin A, Bruk M, Zhikharev E, Sidorov F. Nanophotonic structure formation by dry e-beam etching of the resist: resolution limitation origins. Computer Optics 2016; 41(4): 499-503.ru
dc.identifier.urihttps://dx.doi.org/10.18287/2412-6179-2017-41-4-499-503-
dc.identifier.urihttp://repo.ssau.ru/handle/Zhurnal-Komputernaya-optika/Nanophotonic-structure-formation-by-dry-ebeam-etching-of-the-resist-resolution-limitation-origins-65776-
dc.description.abstractA wide range of structures for nanophotonics and optoelectronics can be formed by dry e-beam etching of the resist (DEBER). High resist sensitivity due to chain depolymerization reaction provides efficient etching with high throughput of the method. The structures obtained by the DEBER in this research are well-rounded diffraction gratings, binary gratings and staircase profiles. The major disadvantage of DEBER is poor lateral resolution, which may be caused by different physical mechanisms. Four groups of possible mechanisms leading to the resolution limitation are determined and the influence of some mechanisms is estimated.ru
dc.description.sponsorshipThis study was partially supported by the President of the Russian Federation's grant No. MK-3327.2017.9.ru
dc.language.isoenru
dc.publisherСамарский университетru
dc.relation.ispartofseries41;4-
dc.subjectDEBERru
dc.subjecte-beam etchingru
dc.subjectnanophotonicsru
dc.subjectdiffractive optical elementsru
dc.subjectdiffractive opticsru
dc.subjectthree-dimensional lithographyru
dc.subjectthree-dimensional fabricationru
dc.subjectmicrolithographyru
dc.subjectoptical design and fabricationru
dc.titleNanophotonic structure formation by dry e-beam etching of the resist: resolution limitation originsru
dc.typeArticleru
dc.textpartEnergy distribution of secondary electrons is somehow described in [17, 18]. The mean energy of “fast” secondary electrons (energy higher than 100 eV) is about 400 eV for primary electron energy of 20 keV [19]. It seems that the number of sec- ondary electrons with energy higher than 1 keV is negli- gible. So, in the worst case the generation of secondary electrons can results in 30-40 nm broadening of trench. a) b) Fig. 5. T...-
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